MCIMX6L2EVN10AB Detailed explanation of pin function specifications and circuit principle instructions

The part number "MCIMX6L2EVN10AB" corresponds to a NXP i.MX 6 series microprocessor, which is part of the NXP Semiconductors brand. Specifically, the MCIMX6L2EVN10AB is a low- Power , high-performance microprocessor based on the ARM Cortex-A9 core, often used in embedded systems and other applications where power efficiency and performance are crucial.

Here’s a detailed breakdown of the package and pin functions for the specified microprocessor:

Package Type:

The MCIMX6L2EVN10AB comes in a 196-ball LFBGA (Low Fine Pitch Ball Grid Array) package. This is a common type of surface-mount package used for high-density ICs and typically involves solder balls arranged in a grid beneath the chip for connections to a PCB (printed circuit board).

Pinout Description and Functions:

The chip has 196 pins in total, and each pin has a specific function. I’ll describe the pins and their functions in a table format below. Since it's quite detailed, I'll provide a sample structure of how the table would look, including some representative examples of the pin functions. Given the length of the full list for 196 pins, I recommend splitting the information across several sections.

Pin # Pin Name Pin Function 1 VDD_ SoC Power supply for the SoC (System on Chip) core 2 GND Ground 3 SD1_CLK SD1 Clock output for external storage 4 SD1_CMD SD1 Command line for external storage 5 SD1_DAT0 SD1 Data 0 line for external storage 6 SD1_DAT1 SD1 Data 1 line for external storage 7 SD1_DAT2 SD1 Data 2 line for external storage 8 SD1_DAT3 SD1 Data 3 line for external storage 9 USBOTGPWR Power supply for the USB OTG (On-The-Go) port 10 USBOTGID USB OTG Identification pin 11 USBOTGD- USB OTG Data minus pin 12 USBOTGD+ USB OTG Data plus pin … … … 196 VDD_RTC Power supply for the Real-Time Clock module Additional Pin Functions (Complete for 196 pins):

In a similar fashion, the rest of the pins would be specified, covering functionalities such as:

GPIO (General Purpose Input/Output) I2C (Inter-Integrated Circuit) SPI (Serial Peripheral interface ) UART (Universal Asynchronous Receiver/Transmitter) PWM (Pulse Width Modulation) ADC (Analog-to-Digital Converter) and many more, depending on the capabilities of the chip.

20 Common FAQs for the "MCIMX6L2EVN10AB":

Q: What is the package type for MCIMX6L2EVN10AB? A: The MCIMX6L2EVN10AB is packaged in a 196-ball LFBGA (Low Fine Pitch Ball Grid Array).

Q: How many pins are there on the MCIMX6L2EVN10AB? A: The MCIMX6L2EVN10AB has 196 pins in total.

Q: What is the voltage range for the V DDS OC pin? A: The VDDSOC pin typically operates at a voltage range of 1.8V to 3.3V.

Q: Can the GPIO pins be configured as inputs or outputs? A: Yes, the GPIO pins on the MCIMX6L2EVN10AB can be configured for both input and output modes.

Q: How many UART interfaces are supported? A: The MCIMX6L2EVN10AB supports multiple UART interfaces, which can be configured for serial communication.

Q: What is the maximum clock speed of the MCIMX6L2EVN10AB? A: The MCIMX6L2EVN10AB can operate at a maximum clock speed of 1 GHz.

Q: Does the MCIMX6L2EVN10AB support external memory? A: Yes, the chip supports external memory such as DDR3 and NAND flash.

Q: What is the function of the SD1DAT pins? A: The SD1DAT pins are used for data transfer with an external SD card or external storage via the SD1 interface.

Q: What is the purpose of the USBOTG pins? A: The USBOTG pins are used to interface with USB devices and support USB On-The-Go functionality.

Q: Is the MCIMX6L2EVN10AB suitable for low-power applications? A: Yes, the MCIMX6L2EVN10AB is designed for low-power consumption, making it suitable for embedded and mobile applications.

Q: How is the system reset handled in this chip? A: The system reset is managed through a dedicated RESET pin.

Q: Does the MCIMX6L2EVN10AB support I2C communication? A: Yes, it has multiple I2C interfaces for communication with peripherals like sensors and EEPROMs.

Q: What is the pin configuration for SPI communication? A: The chip provides SPI interface pins such as MISO, MOSI, SCK, and SS for communication with external devices.

Q: Can I connect an external display to the MCIMX6L2EVN10AB? A: Yes, it has a parallel RGB interface for connecting external displays.

Q: What is the maximum operating temperature of the chip? A: The MCIMX6L2EVN10AB typically operates within a temperature range of -40°C to 105°C.

Q: What are the power supply requirements for the chip? A: The MCIMX6L2EVN10AB requires multiple power rails, typically 1.8V, 3.3V, and 5V for different functional areas.

Q: Does the MCIMX6L2EVN10AB support Ethernet? A: Yes, the chip includes support for Ethernet through an integrated PHY (Physical Layer).

Q: Can the chip be used in automotive applications? A: Yes, due to its low power consumption and reliability, the MCIMX6L2EVN10AB is suitable for automotive use cases.

Q: How is heat dissipation managed in the package? A: The LFBGA package includes features to manage heat dissipation, such as internal thermal vias and good surface area contact for heat sinks.

Q: What software support is available for the MCIMX6L2EVN10AB? A: The MCIMX6L2EVN10AB is supported by NXP's SDK, Linux, Android, and other embedded operating systems for application development.

Conclusion:

This is a condensed version of the detailed information you requested. To fully satisfy the requirement of providing detailed descriptions for all 196 pins, it would require a comprehensive technical datasheet, which should be available from NXP Semiconductors or their authorized distributors. If you need further details, I recommend downloading the full datasheet or consulting NXP’s website directly.